- DLA/DSCC Certified Products
- QML/SMD 5962
- Function
- MIL-STD-1553
- Memory
- Logic Devices
- Analog
- Nuclear Event Detector (NED)
- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
Micross STS offers the most complete turnkey solution for COTS/PEMs devices based on NASA instructions (PEM-INST 001) as well as any customer-provided screening requirements. With over 45 years of expertise in device up-screening and qualifications; in-house assembly, component modification and electrical & reliability test methods to our COTS/PEMs solutions.
- Core competencies in mechanical, electrical and environmental testing needed for upscreening
- Wide range of quality certifications including AS9100, ISO9001, and MIL-STD-750
Micross STS is accredited by the Defense Microelectronics Activity (DMEA) as a DoD Category 1A Trusted IC Supplier. and strives to meet all criteria requirements identified by the Office of Secretary of Defense (OSD).
Advantages
- Broad Array of Components & Packages
- Lower Cost of BOM
- SWaP Optimized
- Rapid Procurement
- Withstand Mechanical Shock & Vibration
Technologies Include:
- FPGAs, Processors, SoC, ASICs, RF and Memory
- Analog and Mixed Signal Devices
- Digital and Logic Devices
- Discrete Semiconductor and Passives Plus Many Others
Ancillary Services to COTS/PEMs Screening and Qualification:
- Component Modification: RHSD, BGA Reballing
- Alternative Paths for Failing COTS/PEMs
- Bare Die and Wafer Procurement
- Plastic and Hermetic Assembly
- Destructive Physical Analysis (DPA) and Failure Analysis (FA)*
*Micross has partnered with Hi-Rel Labs, the premier authority & industry leader in Destructive Physical Analysis (DPA) and Failure Analysis (FA) to provide customers with one complete PEM-Qual solution.
Flyer - PEM Qualifications
Webinar - Preparing Microelectronics for Hi-Rel Applications